MicroHAWK F430-F / F420-F / F330-F / F320-F


3D CT X-ray automatic inspection system for high-accuracy detection of internal solder and component defects in electronic assemblies.
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Description
The OMRON VT-X Series 3D CT Automatic Inspection System is a high-precision X-ray inspection platform designed for advanced electronic assembly inspection, including solder joints, internal voids, and hidden structures that cannot be evaluated with optical methods. Utilizing high-resolution 3D computed tomography (CT) imaging, the VT-X Series reconstructs volumetric data of electronic components to enable quantitative defect detection such as void ratio measurement, solder fillet shape evaluation, and internal crack analysis.
The system combines high-speed X-ray acquisition, accurate reconstruction algorithms, and AI-assisted inspection logic to improve inspection accuracy while reducing false calls. Designed for inline or near-line deployment, the VT-X Series supports high-mix, high-volume electronics manufacturing, offering stable inspection performance across varying board designs and component densities.
Additional information
| Brand |
|---|
| System Type | Inspection Method | Key Capability | Application Scope | Model |
|---|---|---|---|---|
| 3D CT X-ray AOI | Computed Tomography (CT) | Full 3D internal structure reconstruction | Advanced PCB solder inspection | VT-X750 |
| 3D CT X-ray AOI | Computed Tomography (CT) | High-speed 3D reconstruction | Inline SMT inspection | VT-X850 |











