MicroHAWK F430-F / F420-F / F330-F / F320-F

3D CT X-ray automatic inspection system for high-accuracy detection of internal solder and component defects in electronic assemblies.

Description

The OMRON VT-X Series 3D CT Automatic Inspection System is a high-precision X-ray inspection platform designed for advanced electronic assembly inspection, including solder joints, internal voids, and hidden structures that cannot be evaluated with optical methods. Utilizing high-resolution 3D computed tomography (CT) imaging, the VT-X Series reconstructs volumetric data of electronic components to enable quantitative defect detection such as void ratio measurement, solder fillet shape evaluation, and internal crack analysis.

The system combines high-speed X-ray acquisition, accurate reconstruction algorithms, and AI-assisted inspection logic to improve inspection accuracy while reducing false calls. Designed for inline or near-line deployment, the VT-X Series supports high-mix, high-volume electronics manufacturing, offering stable inspection performance across varying board designs and component densities.

Additional information

Brand

System TypeInspection MethodKey CapabilityApplication ScopeModel
3D CT X-ray AOIComputed Tomography (CT)Full 3D internal structure reconstructionAdvanced PCB solder inspectionVT-X750
3D CT X-ray AOIComputed Tomography (CT)High-speed 3D reconstructionInline SMT inspectionVT-X850